To provide an organic metal conductor composition which constitutes paste excellent in film-forming performance, a thermal head having an electrode pattern formed with such an organic metal conductor composition, and a manufacturing method for the thermal head.

The composition contains an organic zinc compound at a ratio of 0.002-1 mass% in terms of Zn to 100 mass% of an organic gold compound in terms of Au, and can contain a silicon compound at a ratio of 0-0.5 mass% in terms of Si and at a ratio of 1 mass% or less of a total of the organic zinc compound (in terms of Zn) and the silicon compound. The composition also contains an organic rhodium compound and/or an organic bismuth compound at a ratio of 0.01-10 mass% of a total of these in terms of Rh and Bi. Since such a composition constitutes the paste excellent in the film-forming performance (denseness, smoothness and the like), it is the most suitable for use in the electrode for the thermal head.