Title:
ORGANOSILICON COMPOUND
Document Type and Number:
Japanese Patent JP2002114793
Kind Code:
A
Abstract:
To obtain an organosilicon compound useful as an auxiliary for improving adhesiveness to metals and alloys such as aluminum, iron, SUS, nickel alloy, chromium alloy, copper alloy, etc., plastics such as acrylic resin, nylon, PPS, PBT, PET, epoxy resin, polyimide, polyvinyl chloride, etc., ceramics such as alumina, silicon nitride, etc., by adding the organosilicon compound to a thermosetting elastomer composition, etc.
This organosilicon compound contains (A) a ≥3C perfluoroalkyl group which may contain an ether oxygen atom in the middle of bond, (B) a monofunctional hydrocarbon group containing a carboxylic anhydride structure and (C) a hydrosilyl group (SiH group) in one molecule.
Inventors:
MATSUDA TAKASHI
SHIONO MIKIO
FUKUDA KENICHI
SHIONO MIKIO
FUKUDA KENICHI
Application Number:
JP2000306309A
Publication Date:
April 16, 2002
Filing Date:
October 05, 2000
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C07F7/12; C07F7/08; C08G77/24; (IPC1-7): C07F7/12; C08G77/24
Attorney, Agent or Firm:
Takashi Kojima (2 outside)