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Title:
有機ケイ素化合物およびその製造方法
Document Type and Number:
Japanese Patent JP6597879
Kind Code:
B2
Abstract:
An organosilicon compound represented by formula (1), which has, per alkoxysilyl group, a plurality of epoxy groups each capable of reacting with an organic resin moiety to form a bond and which hence is useful as a primer, a resin modifier, etc. (In the formula, the R 1 moieties each independently represent an (un)substituted C 1-10 alkyl group, etc.; the R 2 moieties each independently represent an (un)substituted C 1-10 alkyl group, etc.; the R 3 moieties each independently represent a hydrogen atom or a methyl group; A 1 represents a single bond, O, S, NH, or a divalent linking group containing a heteroatom; A 2 represents a single bond or an (un)substituted C 1-20 divalent hydrocarbon group optionally containing a heteroatom; a and c are each independently a number greater than 0; b, d, e, and f are each independently a number of 0 or greater; and m is an integer of 1 to 3. The repeating units may have been linked in any order.)

Inventors:
Tetsuro Yamada
Hirokami Souna
Application Number:
JP2018504049A
Publication Date:
October 30, 2019
Filing Date:
January 30, 2017
Export Citation:
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Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08F8/42; C08C19/06; C08C19/25; C09D109/00; C09D163/00; C09D183/04; C09J109/00; C09J163/00; C09J183/04
Domestic Patent References:
JP61106585A
JP6505998A
JP62083342A
JP4175306A
JP2012184408A
JP2005120192A
JP7082276A
JP2004059741A
Attorney, Agent or Firm:
Hideaki International Patent Office