CARD-LIKE SUBSTRATE AND MANUFACTURE THEREOF - OMRON TATEISI ELECTRONICS CO

Title:

CARD-LIKE SUBSTRATE AND MANUFACTURE THEREOF

Document Type and Number:

Japanese Patent JPH061096

Kind Code:

A

Abstract:

PURPOSE: To thin a card-like substrate containing an IC chip and improve assembly workability.

CONSTITUTION: Printed substrate is made to be substrates on both faces. A copper foil wiring pattern 12 on one substrate and the printed substrate 11, are notched, and an IC chip 17 is fixed on other copper foil 14. A spacer substrate 15 having an opening 15a wider than an insert aperture 11a of the IC chip 17 is arranged on the top surface of the printed substrate. A terminal in the IC chip and the wiring pattern 12 are connected by wire bonding and the insert aperture 11a is filled with resin. In this manner, a card-like substrate can be made thin and use of a heat resisting film is not necessary, so that manufacturing process can be simplified.

Inventors:

KANDA YOSHIMI
IWAMAE YOSHIKI
NAKAI TOMOYUKI
KAWAI WAKAHIRO

Application Number:

JP18457492A

Publication Date:

January 11, 1994

Filing Date:

June 17, 1992

Export Citation:

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Assignee:

OMRON TATEISI ELECTRONICS CO

International Classes:

B42D15/10; G06K19/07; G06K19/077; (IPC1-7): B42D15/10; G06K19/07; G06K19/077

Attorney, Agent or Firm:

Yoshiki Okamoto (1 person outside)

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