Title:
面外構造及び面外構造を作製するための方法
Document Type and Number:
Japanese Patent JP6949782
Kind Code:
B2
Abstract:
A three dimensional device comprises a substrate and a film comprising one or more stress engineered layers. The film includes elastic portions that are curled out of plane with respect to the substrate and anchor portions that attach the elastic portions and to the substrate. An outer conductive layer is disposed over the elastic portions and the anchor portions. The device includes one or more electrically conductive stubs that extend between two adjacent anchor portions without electrically connecting the two adjacent anchor portions.
Inventors:
You One
Christopher El Chua
Cian Wang
Christopher El Chua
Cian Wang
Application Number:
JP2018119619A
Publication Date:
October 13, 2021
Filing Date:
June 25, 2018
Export Citation:
Assignee:
Palo Alto Research Center, Inc.
International Classes:
H01F17/00; B81C1/00; H01F5/00
Domestic Patent References:
| JP2007235130A | ||||
| JP2004503929A | ||||
| JP2004056133A |
Foreign References:
| US20020173146 |
Attorney, Agent or Firm:
Shinichiro Tanaka
Disciple Maru Ken
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda
Hiroshi Uesugi
Naoki Kondo
Takeo Nasu
Teshima Takuji
Disciple Maru Ken
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda
Hiroshi Uesugi
Naoki Kondo
Takeo Nasu
Teshima Takuji