Title:
【発明の名称】半導体装置の欠陥検出方法
Document Type and Number:
Japanese Patent JP2608972
Kind Code:
B2
Inventors:
Shinji Nakano
Tetsuaki Wada
Tetsuaki Wada
Application Number:
JP18655990A
Publication Date:
May 14, 1997
Filing Date:
July 13, 1990
Export Citation:
Assignee:
Matsushita Electronics Industrial Co., Ltd.
International Classes:
H01L21/66; G01N1/36; G01N21/88; G01N21/956; (IPC1-7): H01L21/66; G01N1/36; G01N21/88
Domestic Patent References:
| JP5237085A | ||||
| JP52132682A | ||||
| JP1286432A |
Attorney, Agent or Firm:
Tomoyuki Takimoto (1 person outside)