Title:
【発明の名称】接着半導体基板の製造方法
Document Type and Number:
Japanese Patent JP2662495
Kind Code:
B2
Inventors:
TOMITA SHINICHI
Application Number:
JP15755293A
Publication Date:
October 15, 1997
Filing Date:
June 28, 1993
Export Citation:
Assignee:
SUMITOMO SHICHITSUKUSU KK
International Classes:
H01L21/02; H01L21/304; (IPC1-7): H01L21/02; H01L21/304
Domestic Patent References:
| JP6176993A |
Attorney, Agent or Firm:
Mori Masazumi