Title:
【発明の名称】半導体基板の製造方法
Document Type and Number:
Japanese Patent JP2699347
Kind Code:
B2
Inventors:
Hisahiro Ansai
Takanori Hayato
Takanori Hayato
Application Number:
JP9142287A
Publication Date:
January 19, 1998
Filing Date:
April 14, 1987
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/20; H01L21/263; (IPC1-7): H01L21/20
Domestic Patent References:
| JP5893217A | ||||
| JP61131413A | ||||
| JP63313813A |
Attorney, Agent or Firm:
Hidekuma Matsukuma