Title:
【発明の名称】電子部品用基板の製造方法
Document Type and Number:
Japanese Patent JP2865368
Kind Code:
B2
Inventors:
YAMAZAKI HIROKI
Application Number:
JP10574090A
Publication Date:
March 08, 1999
Filing Date:
April 20, 1990
Export Citation:
Assignee:
NIPPON DENKI GARASU KK
International Classes:
G01R33/00; C03C27/00; C03C27/04; C04B37/00; C04B37/02; C04B37/04; H05K1/03; (IPC1-7): C03C27/04; C04B37/00; C04B37/02; C04B37/04; G01R33/00; H05K1/03
Domestic Patent References:
| JP5141016A | ||||
| JP5542228A |