Title:
【発明の名称】半導体基板への硼素拡散方法
Document Type and Number:
Japanese Patent JP2870231
Kind Code:
B2
Inventors:
SHINOMYA MASARU
MOROGA ISAO
OOTA YUTAKA
KATAYAMA MASAYASU
MOROGA ISAO
OOTA YUTAKA
KATAYAMA MASAYASU
Application Number:
JP17167191A
Publication Date:
March 17, 1999
Filing Date:
June 17, 1991
Export Citation:
Assignee:
SHINETSU HANDOTAI KK
International Classes:
C01B35/02; H01L21/225; (IPC1-7): H01L21/225; C01B35/02
Domestic Patent References:
| JP5671933A | ||||
| JP6092611A | ||||
| JP453127A | ||||
| JP4102316A |
Attorney, Agent or Firm:
Koichi Tateno