Title:
【発明の名称】バンプ形成方法
Document Type and Number:
Japanese Patent JP2976645
Kind Code:
B2
Abstract:
PURPOSE:To form bumps free from variation in height and diameter by a wire bonding means. CONSTITUTION:The title bump forming method is constituted of the following: a process wherein a ball B' is formed at the lower end portion of a wire 36 led out from a capillary toll 51, by using a torch electrode, a process wherein the capillary tool 51 is made to descend, and the ball B' is pressed against an electrode 64 of a chip P, a process wherein, after the capillary tool 51 is made to ascend and move a little in the horizontal direction, the capillary tool 51 is again made to descend as far as the height where the lower end portion does not come into contact with the ball, and the rising part of the wire from the ball B' is made fragile, and a process wherein the capillary tool 51 is made to ascend, and the wire 36 is cut out from a rising-up part 36a by clamping the wire 36 and pulling it up with a clamper 63.
Inventors:
FUNATSU KAZUYUKI
TAKADA TAKESHI
TAKADA TAKESHI
Application Number:
JP29685391A
Publication Date:
November 10, 1999
Filing Date:
November 13, 1991
Export Citation:
Assignee:
MATSUSHITA DENKI SANGYO KK
International Classes:
H01L21/60; H01L21/321; (IPC1-7): H01L21/60
Domestic Patent References:
| JP63173345A | ||||
| JP286132A | ||||
| JP212919A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)