Title:
【発明の名称】プリント配線板の製造方法
Document Type and Number:
Japanese Patent JP3012622
Kind Code:
B1
Abstract:
The present invention provides a printed wiring board formed with a film thereon, wherein the printed wiring board has at least a first reference mark and at least a first scale mark separated from the first reference mark, and the film has at least a second reference mark and at least a second scale mark separated from the second reference mark, and the second scale is positioned to overlap the first scale, and the first scale mark has a first scale and the second scale mark has a second scale which is so different from the first scale as to allow measuring a necessary amount of compensation in alignment to the film with reference to the printed wiring board.
Inventors:
Tsutomu Goshima
Application Number:
JP32655398A
Publication Date:
February 28, 2000
Filing Date:
November 17, 1998
Export Citation:
Assignee:
Toyama NEC Corporation
International Classes:
H05K1/02; H05K3/00; H05K3/06; H05K3/34; (IPC1-7): H05K3/00; H05K3/06
Domestic Patent References:
| JP6177505A | ||||
| JP60249385A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)