【発明の名称】湾曲した基材のコーティング用PCVD法及び装置

Japanese Patent JP3172537

B2

PCT No. PCT/EP95/01168 Sec. 371 Date Jan. 22, 1997 Sec. 102(e) Date Jan. 22, 1997 PCT Filed Mar. 29, 1995 PCT Pub. No. WO95/26427 PCT Pub. Date Oct. 5, 1995A PCVD process for producing coating layers of uniform thickness of domed substrates. The substrate surface to be coated is arranged in relation to the gas passage surface of a gas showerhead. In order to determine the appropriate processing parameters, in a first series of tests for one type of substrate to be coated, the size of the gas passage surfaces and the gas mass flows through the gas passage surfaces are kept constant, while the intervals between plasma impulses are gradually modified, from an initial value tA until an optimum value teff is determined, and until the uniformity of the thickness profile of the layers generated on the substrate may no longer be improved. If required, during a second series of tests, the value teff may be kept constant, while the thickness profile of the layers is further modified by further optimizing the local parameters and/or the gas mass flows until layer uniformity may no longer be improved. The device includes a gas showerhead subdivided into zones and having gas passage surfaces arranged depending on the substrate being coated. The zones are connected by supply lines to a source of non film-forming gas and to a gas source that supplies fresh gas.

Hemming, martin
Lange, Ulrich
Langfeld, Roland
Mail, Wolfgang
Otto, Jurgen
Packet, folkel
Zegner, Johannes
Walter, Marten

JP52498095A

June 04, 2001

March 29, 1995

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Carl-Zeiss-Stiftung

C23C16/44; C23C16/455; G02B1/11; C23C16/50; C23C16/511; C23C16/515; C23C16/52; (IPC1-7): C23C16/52; G02B1/11

JP4224681A

▲吉▼田 繁喜

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