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Patent Searching and Data


Title:
【発明の名称】低温で糊化するサツマイモデンプンおよびそのデンプンを塊根中に含むサツマイモの作出方法
Document Type and Number:
Japanese Patent JP3366939
Kind Code:
B2
Inventors:
Kenji Katayama
Seiji Tamiya
Katsumi Komaki
Application Number:
JP2000099090A
Publication Date:
January 14, 2003
Filing Date:
March 31, 2000
Export Citation:
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Assignee:
Agricultural Technology Research Organization
International Classes:
A01H1/00; A23L1/0522; A23L19/10; C08B30/00; C13K1/06; (IPC1-7): C08B30/00; A01H1/00; A23L1/0522; A23L1/214; C13K1/06
Domestic Patent References:
JP6305799A
Attorney, Agent or Firm:
Yusuke Hiraki (3 outside)