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Title:
INCISION DEPTH MONITORING DEVICE
Document Type and Number:
Japanese Patent JPH0615468
Kind Code:
A
Abstract:

PURPOSE: To provide the incision depth monitoring device by which a measurement error of incision depth of an incised groove can be reduced remarkably.

CONSTITUTION: The monitoring device is provided with a hand piece 3 for irradiating a part to be irradiated of an object to be incised with a laser beam from the tip, a transducer which is provided in the hand piece 3 and detects an acoustic wave which is generated in the part to be irradiated at the time of irradiating the part to be irradiated with the laser beam and propagated in the air, and an arithmetic means for calculating incision depth of the part to be irradiated based on a detection signal outputted from the transducer. Also, the hand piece 3 is provided with an assist gas introducing tube 160 and an opening part 161 for reducing a measurement error of incision depth by eliminating a scattered matter 9 generated from the part to be irradiated at the time of irradiating the part to be irradiated with the laser beam.


Inventors:
FUJISAKA SHINICHI
SATO KATSUHIKO
Application Number:
JP17550392A
Publication Date:
January 25, 1994
Filing Date:
July 02, 1992
Export Citation:
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Assignee:
GIJUTSU KENKYU KUMIAI IRYO FUK
International Classes:
A61B18/20; B23K26/00; B23K26/14; B23K26/38; (IPC1-7): B23K26/00; A61B17/36; B23K26/00; B23K26/14
Domestic Patent References:
JPH02192888A1990-07-30
JPS59220294A1984-12-11
Attorney, Agent or Firm:
Yoshiki Hasegawa (3 outside)