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Patent Searching and Data


Title:
PACK PLATE FOR GAS-LIQUID CONTACT
Document Type and Number:
Japanese Patent JP2017138064
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a pack plate for gas-liquid contact capable of enhancing efficiency of heat exchange by increasing a treatment water amount holdable on a surface of a pack plate for gas-liquid contact without increasing air resistance.SOLUTION: A pack plate for gas-liquid contact is configured to perform heat exchange by direct contact with air, while flowing treatment water down along a surface of a sheet-like plate, wherein the surface of the plate includes an upward inclination surface 21a and a downward inclination surface 21b formed into a zigzag shape on a longitudinal cross section, and on the surface of the plate, a flow resistance imparting part 21c is formed as a resistance against flow of the treatment water.SELECTED DRAWING: Figure 1

Inventors:
TATSUMI MICHIO
KOIKE YASUTOMO
UEDA SATOSHI
Application Number:
JP2016019761A
Publication Date:
August 10, 2017
Filing Date:
February 04, 2016
Export Citation:
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Assignee:
NIPPON SPINDLE MFG CO LTD
International Classes:
F28F25/08; F28C1/04
Attorney, Agent or Firm:
Osamu Mori
Tsutomu Inoue