Title:
PACKAGE BOARD
Document Type and Number:
Japanese Patent JP3188863
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a package board which can shorten the transmission line between an upper and lower-layers conductor wirings.
SOLUTION: Lands 41a are integrated with pads 41b and hence connected to the pads without having to go through via wirings, thereby shortening the transmission line between a lower layer (conductor circuit 58D beneath a core board 30) and a conductor wiring 58U on the upside of an upper layer (layer insulation resin layer 50) to enhance the signal transmission rate and reduce the resistance. Because of the lands 41a are connected to the pads 41b without intermediary of wirings, stress is not concentrated on the connections between the wiring and lands and between wiring and pads, unlike the conventional package board, and thus wire breakings due to crackings from stress concentration does not occur in the package board.
Inventors:
Motoo Asai
Yoji Mori
Yoji Mori
Application Number:
JP36194797A
Publication Date:
July 16, 2001
Filing Date:
December 10, 1997
Export Citation:
Assignee:
IBIDEN Co., Ltd.
International Classes:
H05K3/46; H01L23/12; (IPC1-7): H01L23/12
Domestic Patent References:
| JP832240A | ||||
| JP9298364A |
Attorney, Agent or Firm:
Akito Tagashita (1 person outside)
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