Title:
PACKAGE FOR CONTAINING AND DISPENSING LARGE QUANTITIES OF WIRE
Document Type and Number:
Japanese Patent JP3718493
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide package for effectively containing and dispensing large quantities of wire.
SOLUTION: The package for containing and dispensing wire from a coil of wire has an outer surface, inner surface, and a top and a bottom defining a coil height comprising an outer carton having a rectangular bottom and four side panels extending upwardly from the bottom wall. The package further includes an octagonal inner liner having eight walls, and wherein every other wall engages a portion of one of the side panels of the outer carton. The package has a planar retainer ring which engages the top of the wire coil and which has an opening forming an inner edge and an outer periphery comprising a plurality of nodes extending radially outwardly beyond the outer surface of the wire coil. Adjacent nodes are connected by node edge extending inwardly across the outer surface of the coil and at least one of the nodes interengages with the liner at a corner between adjacent walls of the liner to prevent the retainer ring from rotating relative to the inner liner and to prevent the wire from passing the outer peripheral edge of the retainer ring.
Inventors:
James land
Application Number:
JP2002256294A
Publication Date:
November 24, 2005
Filing Date:
September 02, 2002
Export Citation:
Assignee:
Lincoln Global Incorporated
International Classes:
B65D85/04; B23K9/133; B23K9/32; B65H49/06; B65H49/08; B65H57/18; B65H59/06; (IPC1-7): B65H59/06; B65D85/04; B65H49/06
Domestic Patent References:
| JP111633Y2 | ||||
| JP627646Y2 |
Attorney, Agent or Firm:
Takehiko Saito
Yasuyuki Hata
Yasuyuki Hata
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