Title:
PACKAGE FOR ELECTRONIC COMPONENT STORAGE
Document Type and Number:
Japanese Patent JP3164800
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enable an electronic component which is stored inside to normally and stably operate by increasing the airtight reliability by neither sticking a brazing material on the electronic component nor forming many gasp between a frame-shaped metallized layer and a metallic lid body, when the frame-shaped metallized layer and metallic lid body are jointed by seam welding.
SOLUTION: This package comprises an insulating base 1, having a mount part 1a which has an electronic component 3 mounted on its top surface and a frame-shaped metallized layer 5 for sealing, which is adhered surrounding the mount part 1a and a metallic lid body 2, which is jointed to the frame- shaped metallized layer 5 by seam welding with a brazing material, and the frame shaped metallized layer 5 has an area of 5 μm or smaller height, along the width at a distance of 0.1 mm or larger from its inner peripheral edge and outer peripheral edge and the brazing material 6 adhered to the metallic 1 id body 2 is 10 to 30 μm thick. Consequently, the brazing material 6 will not scatter in the package to stick on inside electronic component 3.
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Inventors:
Masaki Suzuki
Application Number:
JP26059699A
Publication Date:
May 08, 2001
Filing Date:
September 14, 1999
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
B23K1/14; B23K3/04; C04B37/02; H01L23/02; (IPC1-7): H01L23/02
Domestic Patent References:
| JP11111876A |