Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PACKAGE FOR ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2004087890
Kind Code:
A
Abstract:

To provide a package for electronic components, which improves the adhesive strengths between a base 101 and insulated leads 102a and 102b and a resin-based adhesive 103.

The adhesive strengths between the base 1 and insulated leads 2a and 2b and a resin having an electrical insulating property are increased by forming triazine thiol dielectric coating films on the surfaces of the base 1 and leads 2a and 2b.


More Like This:
JP3623179Semiconductor element storage package and semiconductor device
JPH11176969SEAL CAP COMPONENT FOR CERAMICS PACKAGE AND CERAMICS PACKAGE USING THE SAME
Inventors:
NAKANO AZUSA
USUI TAKUMI
Application Number:
JP2002248234A
Publication Date:
March 18, 2004
Filing Date:
August 28, 2002
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L23/04; H01L23/10; H01L33/48; (IPC1-7): H01L23/04; H01L23/10; H01L33/00
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito



 
Previous Patent: LEAD FRAME FOR SEMICONDUCTOR DEVICE

Next Patent: CHOKE COIL