Title:
PACKAGE FOR ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH11126847
Kind Code:
A
Abstract:
To enhance the hermetic sealing reliability of a case for electronic component.
The package for electronic component comprises a ceramic basic body having an outer circumferential frame part 2 on the upper surface thereof, a frame-like metallized layer 7 applied to the upper surface of the frame part 2, a metallic frame body 8 brazed to the metallization layer 7, and a metallic cover body 3 welded to the metallic frame body 8. An electronic component is contained hermetically in a package. A noncontact region B of brazing material is formed within a width of at least 30 μm from the outer circumferential side of the metallized layer 7.
Inventors:
KIYOSADA KAN
Application Number:
JP28969597A
Publication Date:
May 11, 1999
Filing Date:
October 22, 1997
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
B23K1/19; H01L23/02; H01L23/10; (IPC1-7): H01L23/10; B23K1/19; H01L23/02