Title:
PACKAGE, ELECTRONIC DEVICE, MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC APPARATUS AND MOVABLE BODY
Document Type and Number:
Japanese Patent JP2015207727
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a package improving airtightness.SOLUTION: A package comprises: a storage space portion 56; and a first substrate 50 forming at least a part of the storage space portion 56. A first through-hole 58 extending from a first principal surface 51 of an opposite side to the storage space portion 56 toward a second surface 52 of the storage space portion 56 side is provided in the first substrate 50. The first through-hole 58 has a first inclined portion 71 inclined from the second surface 52 toward the first principal surface 51 and a second inclined portion 72 inclined from one end of the first principal surface 51 side of the first inclined portion 71 toward the first principal surface 51 in a sectional view of the first through-hole 58. A second angle θ2 between the second inclined portion 72 and the second surface 52 is greater than a first angle θ1 between the first inclined portion 71 and the second surface 52, and the first through-hole 58 is sealed with a seal member 70.
Inventors:
NARUSE ATSUNORI
Application Number:
JP2014088893A
Publication Date:
November 19, 2015
Filing Date:
April 23, 2014
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H01L23/02; G01P15/08; H01L29/84
Domestic Patent References:
| JP2005064024A | 2005-03-10 | |||
| JP2007214315A | 2007-08-23 | |||
| JPS5232269A | 1977-03-11 | |||
| JPH11340348A | 1999-12-10 | |||
| JP2009135296A | 2009-06-18 |
Attorney, Agent or Firm:
Masahiko Ueyanagi
Kazuaki Watanabe
Kazuaki Watanabe