PACKAGE AND ELECTRONIC APPARATUS - NGK ELECTRONICS DEVICES INC

Title:

PACKAGE AND ELECTRONIC APPARATUS

Document Type and Number:

Japanese Patent JP2022169064

Kind Code:

A

Abstract:

To provide a package that can secure reliability on a joint between a frame body and a lid body, while enhancing heat radiation performance of a heat sink, and an electronic apparatus including the same.SOLUTION: A package 10C has a cavity CV that is sealed with a lid body 80C. The package 10C includes: a heat sink 13 having a linear expansion coefficient of 9 ppm/°C or more and 15 ppm/°C or less at temperatures of 25°C-100°C; and a frame body 14C, provided on the heat sink 13 and made of ceramics, which surrounds the cavity CV in a planar view. In the planar view, an outer edge of the frame body 14C includes a first straight line portion LN1 extending along a first direction, a second straight line portion LN2 extending along a direction orthogonal to the first direction, and a chamfering portion CM1 joining the first straight line portion LN1 to the second straight line portion LN2.SELECTED DRAWING: Figure 1

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Inventors:

SHIRAI NAOYA
MIHARA YOSHIKAZU
YAMAMOTO TOMOYASU

Application Number:

JP2021074861A

Publication Date:

November 09, 2022

Filing Date:

April 27, 2021

Export Citation:

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Assignee:

NGK ELECTRONICS DEVICES INC
NGK INSULATORS LTD

International Classes:

H01L23/36; H01L23/02; H01L23/08

Attorney, Agent or Firm:

Hidetoshi Yoshitake
Takahiro Arita
Kazuki Nakao
Hiroyuki Kita

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