Title:
PACKAGE FOR HIGH FREQUENCY
Document Type and Number:
Japanese Patent JP3696735
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To provide a package for high frequency which is easily assembled without degrading electromagnetic coupling, suppresses variation in electromagnetic coupling, and is superior in productivity.
SOLUTION: A lid 3 for hermetically sealing a high-frequency element 5 mounted on the surface of a dielectric substrate 2 is formed. Signal lines 6 and signal lines 8 are formed on the surface and underside of the dielectric substrate 2 respectively, and the signal lines 6 and 8 are electromagnetically coupled with each other through slot holes 10 formed in a ground layer 9 in the dielectric substrate 2. Through-holes 11, extending from the slot hole 10 formation portions of the dielectric substrate 2 to the underside of the dielectric substrate 2 and having the same shape as the slot holes 10, are formed by laser, punching, or the like and filled with a material 12 different from that of the dielectric substrate 2. As a result, the signal lines 8 comprising leads, for example, can be placed on the underside of the dielectric substrate 2 with good accuracy.
Inventors:
Ueda, Yoshiaki
Kitazawa, Kenji
Koriyama, Shinichi
Kitazawa, Kenji
Koriyama, Shinichi
Application Number:
JP1998000245358
Publication Date:
July 08, 2005
Filing Date:
August 31, 1998
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H01L23/12; H01L23/02; H01L23/04; H01L23/12; H01L23/02; (IPC1-7): H01L23/02; H01L23/12
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