Title:
PACKAGE FOR HOUSING OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3881574
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To suppress the deviation of an optical axis between an optical semiconductor device and an optical fiber caused when the optical semiconductor device is screwed in an external electric circuit board, etc., and to effectively suppress the deterioration of a signal waveform caused by optical fiber internal reflection loss and polarization mode dispersion during operation of the optical semiconductor device.
SOLUTION: A thin part 1b having a thickness of 1/4 to 1/2 of the thickness of a base body 1 is formed at a region from just the downside of the inner surface of a side part 2b to just the downside of the side surface of a thermoelectric cooling element 13 or a base 6 for placement which opposes the side part 2b in the base body 1 of a package for housing the optical semiconductor device.
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Inventors:
Daisuke Sakumoto
Application Number:
JP2002089435A
Publication Date:
February 14, 2007
Filing Date:
March 27, 2002
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
G02B6/42; H01L31/02; H01S5/022; (IPC1-7): G02B6/42; H01L31/02; H01S5/022
Domestic Patent References:
| JP5055609A | ||||
| JP59149308A |