Title:
PACKAGE FOR HOUSING OPTICAL SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JP3696737
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To provide a package for housing an optical semiconductor element which makes the hermeticity of the package perfect and is capable of normally and stably operating the optical semiconductor element housed therein for a long period of time.
SOLUTION: This package includes a base body 1 which is erected with ceramic side walls 1b along three sides among the outer peripheries of a ceramic bottom plate 1a of an approximately square shape and a metallic side wall 1c along the remaining one side and a metallic member 8 for fixing the optical fiber which is mounted at the metallic side wall 1c of the base body 1 and is welded with mounting fittings 10 of the optical fiber 9. When the coefficient of thermal expansion of the ceramic bottom plate 1a and the ceramic side walls 1b is defined as (a), the coefficient of thermal expansion of the metallic side wall 1c as (b) and the coefficient of thermal expansion of the metallic member 8 for fixing the optical fiber as (c), these coefficients are a<b<c.
Inventors:
Shibayama, Hiroshi
Application Number:
JP1998000317735
Publication Date:
July 08, 2005
Filing Date:
November 09, 1998
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H01L23/02; G02B6/42; H01L23/06; H01L23/08; H01L23/02; G02B6/42; (IPC1-7): G02B6/42; H01L23/02; H01L23/06; H01L23/08
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