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Title:
PACKAGE INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JP2001292026
Kind Code:
A
Abstract:

To provide a package integrated circuit with a smaller size, at a lower cost than that of a known package integrated circuit, that is used for a wireless frequency device.

This package integrated circuit consists of one or more wireless frequency components included in an integrated circuit die. The integrated circuit die is coupled with a wireless frequency antenna. The wireless frequency antenna is included in the package integrated circuit but not included in the integrated circuit die.


Inventors:
OP, Eynde Frank Nico Lieven T.
Dehaeck, Willy G. J. Y.
Wuyts, Ilse
Terryn, Steven G. A.
Olyslager, Frank
Rogier, Hendrik
DE, Zutter Daniel
Van, Vliet Rick
Application Number:
JP2001000022627
Publication Date:
October 19, 2001
Filing Date:
January 31, 2001
Export Citation:
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Assignee:
ALCATEL
International Classes:
H01L23/28; H01L23/00; H01L23/498; H01L23/552; H01L23/58; H01L23/66; H01Q1/38; H01Q13/10; H01Q23/00; (IPC1-7): H01Q23/00; H01L23/28; H01Q1/38; H01Q13/10
Attorney, Agent or Firm:
川口 義雄 (外2名)



 
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