Title:
PACKAGE FOR LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE INCLUDING THE SAME, AND LIGHTING SYSTEM INCLUDING THE LIGHT EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2014130973
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a package for a light emitting device, suitable for mounting a plurality of light emitting elements and excellent in mountability using a conductive paste.SOLUTION: A package (200) for a light emitting device of the present invention has a longitudinal direction (x) and a transverse direction (y) orthogonal to the longitudinal direction (x), in a top view, and includes first and second lead frames (11, 12) lined up in the longitudinal direction (x), and a resin molded body (20) molded integrally with the first and second lead frames (11, 12). The first lead frame (11) includes a body part (101) and an extension part (102) extending from the body part (101) to the side of the second lead frame (12) while the width thereof becomes narrow. A depression (103) is provided in the lower face of the first lead frame (11), and at least a part of an exposed region (107) in the lower face of the extension part (102) is separated from an exposed region (105) in the lower face of the body part (101) by the resin molded body (20) filling the depression (103).
Inventors:
NAKABAYASHI TAKUYA
HASHIMOTO TOSHIYUKI
HASHIMOTO TOSHIYUKI
Application Number:
JP2012289198A
Publication Date:
July 10, 2014
Filing Date:
December 29, 2012
Export Citation:
Assignee:
NICHIA KAGAKU KOGYO KK
International Classes:
H01L33/62; H01L23/48
Domestic Patent References:
| JP2011249807A | 2011-12-08 | |||
| JP2012182485A | 2012-09-20 | |||
| JP2010153384A | 2010-07-08 | |||
| JP2011134902A | 2011-07-07 |
Foreign References:
| US20120074451A1 | 2012-03-29 | |||
| US20120223343A1 | 2012-09-06 | |||
| US20080042151A1 | 2008-02-21 |