To provide a method of manufacturing packages, a package, a piezoelectric transducer, an oscillator, an electronic apparatus and a radio clock that can improve a yield by reducing warpage of a first substrate and can improve mechanical strength of a package.

The package manufacturing method has a reform process for applying heat to a wafer 40 for a base substrate in a state of being pinched from both sides in the thickness direction by reform jigs between a filling process and a second grinding process, and the reform jigs are warped in an opposite direction to the warp direction of the wafer 40 for a base substrate caused by a difference of thermal expansion coefficients between the wafer 40 for a base substrate and a glass frit 38.