Title:
PACKAGE AND MANUFACTURING METHOD FOR THE SAME
Document Type and Number:
Japanese Patent JP2018177351
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To reduce damage and contamination of an optical waveguide and to enable the optical waveguide to be picked up with high positional accuracy in a package packing the optical waveguide.SOLUTION: In the package including an optical waveguide 100 and a packaging member 5 for packaging the optical waveguide 100, the packaging member 5 is provided with a recess 10 in which the optical waveguide 100 is arranged, and in a cross section intersecting a bottom surface 20 of the recess 10, the bottom surface 20 and the side surface 24 of the recess 10 are connected by a curved surface 22 that is convexed toward the outside of the recess 10.SELECTED DRAWING: Figure 2
Inventors:
KATO MASAAKI
KUBOTA TAKUMI
KUBOTA TAKUMI
Application Number:
JP2017083728A
Publication Date:
November 15, 2018
Filing Date:
April 20, 2017
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
G02B6/12; B65D85/86
Domestic Patent References:
| JP2016034845A | 2016-03-17 | |||
| JP2006222234A | 2006-08-24 | |||
| JP2010047319A | 2010-03-04 |
Attorney, Agent or Firm:
Shinji Hayami