PACKAGE FOR MICROWAVE IC - MITSUBISHI ELECTRIC CORP

Title:

PACKAGE FOR MICROWAVE IC

Document Type and Number:

Japanese Patent JPH0637202

Kind Code:

A

Abstract:

PURPOSE: To suppress as small as possible the reflection of a high frequency signal caused by the mismatching of characteristic impedance on a microwave transmission path by a method wherein, in the package for a microwave IC which can be surface-mounted, the continuity of transmission mode is maintained on the microwave transmission path from the mounting board outside the package to the microwave IC chip inside the package.

CONSTITUTION: The input/output coplanar line parts 10c and 20c on the surface side of a dielectric substrate 110, which constitutes a package 101, and the input/output coplanar line paths 10a and 20a, on the back side of the dielectric substrate 110, are connected by intermediate coplanar line parts 10b and 20b which are incorporated into the dielectric substrate 110.

Inventors:

NOTANI YOSHIHIRO
KATO TAKAYUKI

Application Number:

JP21562392A

Publication Date:

February 10, 1994

Filing Date:

July 20, 1992

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP

International Classes:

H01L21/60; H01L23/02; H01L23/04; H01L23/12; H01L23/66; H01P1/04; H01P3/02; H01P3/08; H01P5/08; H05K1/02; H05K3/34; (IPC1-7): H01L23/12; H01L21/60; H01L23/04; H01P3/02; H01P3/08; H01P5/08

Attorney, Agent or Firm:

Kenichi Hayase

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