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Patent Searching and Data


Title:
PACKAGE MOUNTING BODY
Document Type and Number:
Japanese Patent JP2019062122
Kind Code:
A
Abstract:
To achieve high heat radiation performance in a package mounting body including a back surface heat radiation type semiconductor package.SOLUTION: A package mounting body in which a semiconductor package 20 is thermally connected to a housing component 40 through a heat radiation gel 30 has a structure in which a heat sink 28 having an area wider than a rear surface 21b of an island 21 exposed from a molding resin 26 is disposed through a heat radiation adhesion 27 between the rear surface 21b and the heat radiation gel 30. Thus, an area of a portion which transmits heat to the housing component 40 in the heat radiation gel 30 widens and heat resistance of the heat radiation gel 30 and heat resistance of the entire package mounting body become small to allow the structure to have heat radiation performance higher than a conventional structure. Further, even if a thickness of the heat radiation gel 30 becomes thick due to a dimension error of a member, deterioration of the heat radiation performance is inhibited in the structure.SELECTED DRAWING: Figure 1

Inventors:
國枝 大佳
Application Number:
JP2017186800A
Publication Date:
April 18, 2019
Filing Date:
September 27, 2017
Export Citation:
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Assignee:
株式会社デンソー
International Classes:
H01L23/29; H01L23/31; H01L23/36; H01L23/50
Attorney, Agent or Firm:
特許業務法人ゆうあい特許事務所