Title:
PACKAGE FOR MOUNTING ELECTRONIC CIRCUIT PART
Document Type and Number:
Japanese Patent JPH0541569
Kind Code:
A
Abstract:
PURPOSE: To realize small size and high density mounting of a package for mounting electronic circuit parts.
CONSTITUTION: The title package has a ceramic frame 35 and upper and lower caps 33 and 36. In the inner wall of a through-hole in the ceramic frame 35, a stepped part is formed in which an electronic circuit board 34 is set and fixed. Electronic parts are mounted on both sides of the circuit board 34. The two caps 33 and 36 are made of time metal plate and used for sealing the hole from above and under the frame 35.
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Inventors:
NAGANO TAKAHIRO
Application Number:
JP21660491A
Publication Date:
February 19, 1993
Filing Date:
August 02, 1991
Export Citation:
Assignee:
KOKUSAI ELECTRIC CO LTD
International Classes:
H05K1/14; H05K5/00; H05K5/06; (IPC1-7): H05K1/14; H05K5/06
Domestic Patent References:
| JPH0362951A | 1991-03-19 | |||
| JPS6020058A | 1985-02-01 |
Attorney, Agent or Firm:
Manabu Otsuka (1 person outside)
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