To provide a package for mounting solid-state imaging device, which is small in size, thin in thickness and manufactured inexpensively with a simple process.

In the box type package for mounting the solid imaging device, which is made of a resin and provided with a light transmitting opening on the bottom surface of the same to mount the solid-state imaging device in the posture of face down, the upper surface of inner lead of a lead comprising a conductive metal sheet for realizing electric conduction is exposed on the inner bottom surface near the opening and is bent so that the upper surface and the end part of an outer lead are exposed respectively on the upper surface and the outside surface of the side wall of the box type resin-made package while the part except the both end exposed parts of the lead is embedded into the resin whereby a three-dimensional circuit is formed.