PURPOSE: To form an arbitrarily shaped package structure wherein its heat- dissipating effect is increased and its grounding action is ensured sufficiently by a method wherein a metal sheet and a flexible board are pasted by using a conductive adhesive.

CONSTITUTION: A metal sheet 2 is provided with a function as a grounding action and with a function to perform a heat-dissipating action. It is bent and shaped to various arbitrary shapes. A flexible board 1 is provided with flexibility, and a plurality of components 3, 3,... are attached. The flexible board 1 is attached to the metal sheet 2 in an arbitrary shape along its surface by utilizing the flexibility by means of a conductive adhesive or a conductive magic tape 5. A conductivity is ensured between the metal sheet 2 and the flexible board 1 by means of the conductive adhesive or the conductive magic tape 5.