PURPOSE: To increase pins while improving airtightness and reliability, and to enhance profitability by welding a lead frame to a ceramic substrate with a recessed section for receiving a semiconductor element by low melting-point glass.

CONSTITUTION: A package for a pin grid array (PGA) type semiconductor device having a small mounting area is formed by a ceramic substrate 10 having a recessed section 12 for receiving a semiconductor element and high airtightness. A lead frame 20 is welded to sections except the recessed section 12 in the surface, to which the recessed section 12 is shaped, by low melting- point glass 18, and an internal conductive section is formed without metallizing the substrate 10. According to the constitution, pins are increased while airtightness, reliability and profitability are improved.