To provide a compact, sensitive pressure detecting apparatus that can accurately detect external pressure without bending a ceramic green sheet for use in a ceramic plate in manufacturing.

In the package for use in a pressure detecting apparatus, a first metallization electrode 9 for forming capacitance is provided on one main surface of a ceramic substrate 1 where a semiconductor device 5 is mounted on the other, and a ceramic plate 3 having a second metallization electrode 10 opposite to the first one 9 is sintered in one piece on the other main surface of the ceramic substrate 1 while the ceramic plate is flexible via a ceramic frame body 2 so that closed space S is formed at a portion to the other main surface. In the ceramic plate 3, an auxiliary ceramic frame body 4 having a shape corresponding to the ceramic frame body 2 is laminated on the outside main surface, an auxiliary metallization layer 11 extended to a region corresponding to the outer-periphery section of the closed space S from the bottom of the auxiliary ceramic frame body 4 is deposited.