To provide a small-sized and highly-sensitive pressure detection device capable of detecting the outside pressure accurately.

This package for the pressure detection device is equipped with an insulating substrate 1 having a loading part 1b for loading thereon a semiconductor element 3 on one main surface, plural wiring conductors 5 disposed on the insulating substrate 1, to which each electrode of the semiconductor element 3 is electrically connected, an insulating plate 2 jointed to the insulating substrate 1 in the flexible state to form an enclosed space S between itself and the other main surface of the insulating substrate 1, a first electrode 7 for capacitance formation adhering to the other main surface of the insulating substrate 1, and connected electrically to one 5a of the wiring conductors 5, and a second electrode 8 for capacitance formation adhering to the inside main surface of the insulating plate 2, and connected electrically to another 5b wiring conductor 5. In the package, the wiring conductors 5a, 5b are drawn out to the loading part 1b or its periphery through different insulating layer intervals without being mutually overlapped vertically.