To provide a technology of preventing connection pads provided in a package for a SAW device from being covered by an adhesive.

The package 22 of a SAW oscillator 10 contains a surface acoustic wave element chip 14 and an integrated circuit 16. A component mount section 40 for mounting the integrated circuit 16 is located at a position higher than a position of an element chip mount section 36 for mounting the surface acoustic wave element chip 14. A height difference h between the element chip mount section 36 and the component mount section 40 is nearly equal to a height difference between the surface acoustic wave element chip 14 and the integrated circuit 16, and the height of an upper face of the surface acoustic wave element chip 14 after the mount is selected to be nearly equal to the height of an upper face of the integrated circuit 16. Further, the height of the element chip connection pads electrically connected to electrodes of the surface acoustic wave element chip 14 via bonding wires 50 and the height of the component connection pads electrically connected to terminals of the integrated circuit 16 via bonding wires are located at positions equal to or higher than the height of the component mount section 40.