Title:
PACKAGE SEALING METHOD DEPENDENT UPON SOLDER
Document Type and Number:
Japanese Patent JPS5484976
Kind Code:
A
Abstract:
PURPOSE:To prevent oxidation to obtain a good wetness by arrabging a sealed package, where sealing solder is interposed between sealing-intended faces, in an inactive atmosphere and heating intended faces to melt solder after changing air pressure in the atmosphere to substitute air in the package. CONSTITUTION:Semiconductor element 2 is mounted on stem substance 1 of an alumina porcelain, and plural lead wires are fitted, and Au metalize layer 1a is caused to adhere onto the sealing-intended face of substrance 1. The sealing-intended face of cover 4 made in ceramic is also provided with Au metalize layer 4a, and sealing solder 5 of Au 80 % and Zn 20 % is interposed between these intended faces 1a and 4a. Package A constituted in this manner is arranged in furnace 6, and cocks 12 and 11 are closed and opened respectively to lead gas of N2 90 % and H2 10 % in, thereby making an atmospheric pressure of 4. Next, cocks 12 and 11 are opened and closed reversely to make an atmospheric pressure of 1, and then these operations are repeated to emit air in package A, and electric heater 9 is used to melt solder 5.
Inventors:
GOTOU EIZOU
Application Number:
JP15234177A
Publication Date:
July 06, 1979
Filing Date:
December 20, 1977
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H05K5/06; H01L21/50; H01L23/02; (IPC1-7): H01L21/50; H05K5/06
Previous Patent: PRODUCTION UNIT FOR SEMICONDUCTOR DEVICE
Next Patent: FORMING METHOD OF SEMICONDUCTOR SURFACE PROTECT FILM
Next Patent: FORMING METHOD OF SEMICONDUCTOR SURFACE PROTECT FILM