Title:
PACKAGE FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE EMPLOYING IT
Document Type and Number:
Japanese Patent JP3847248
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a package for a semiconductor element in which transmission characteristics of electric signal are improved between I/O pads and first wiring conductors connecting an external electric circuit with a semiconductor element by preventing reflection of high frequency electric signals on the I/O pads, and to provide a semiconductor device employing it.
SOLUTION: The package for a semiconductor element comprises a substrate 1 having a part 1a for mounting a semiconductor element 6, a plurality of ground wiring conductors 2b and first wiring conductors 2a formed on the substrate 1, a plurality of ground pads 3b and I/O pads 3a connected electrically with the ground wiring conductors 2b and first wiring conductors 2a, second wiring conductors 4 formed on the substrate 1, and a connector 5 consisting of conductive wires 5a and an insulating enclosure 5b wherein the wires 5a are connected electrically with second wiring conductors 4. The I/O pad 3a has a plane area not larger than 0.196 mm2 and the substrate 1 has a linear expansion coefficient in the range of 9×10-6/°C-20×10-6/°C.
Inventors:
Tetsuo Hirakawa
Shin Matsuda
Yoshinobu Sawa
Shin Matsuda
Yoshinobu Sawa
Application Number:
JP2002321750A
Publication Date:
November 22, 2006
Filing Date:
November 05, 2002
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/12; (IPC1-7): H01L23/12
Domestic Patent References:
| JP2002151621A | ||||
| JP2001168443A | ||||
| JP11243163A | ||||
| JP2002164466A | ||||
| JP11312747A | ||||
| JP2000188359A | ||||
| JP2004158575A | ||||
| JP2004179178A |
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