Title:
PACKAGE FOR SEMICONDUCTOR DEVICE AND ITS PACKAGING STRUCTURE
Document Type and Number:
Japanese Patent JP3178452
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a ceramic package having a head sink structure and to provide its packaging structure.
SOLUTION: A ceramic side wall 2 is integrally formed on a heat sink 1. A circuit element 7 mounted on the heat sink 1 is connected to external connection electrodes 5 formed on a rear face at the lower side of the ceramic side wall 2. On an outer surface of the ceramic side wall 2, outside electrodes 6 for shielding to be connected to the heat sink 1 are formed. When mounting the thus fabricated package for a semiconductor device on an equipment, the external connection electrodes 5 of the package are directly and electrically connected to a microstrip line 102 on a microstrip substrate 101. Since no bridge- structured leads are used, there is no deterioration and no variation in frequency characteristics. By shielding the package by the outside electrodes 6, there is no influence by an outside electromagnetic field.
Inventors:
Yasushi Ogasawara
Application Number:
JP4650799A
Publication Date:
June 18, 2001
Filing Date:
February 24, 1999
Export Citation:
Assignee:
NEC
International Classes:
H01L23/12; H01L23/02; H01L23/14; (IPC1-7): H01L23/12
Attorney, Agent or Firm:
Suzuki Akio