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Patent Searching and Data


Title:
PACKAGE OF SEMICONDUCTOR INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JPH04145651
Kind Code:
A
Abstract:

PURPOSE: To miniaturize a package by making a multiple terminal and to reduce an actually-mounting area and a weight by a method wherein a conductive body transmitting a plurality of signals into one lead wire and an insulating body for insulating between conductive bodies are provided.

CONSTITUTION: In a package 1, an external terminal of a lead wire 4 is connected with a substrate 2 and an internal terminal of the wire 4 is connected with a sub-substrate 3. Signals from a bonding wire 8 enter a terminal 5, pass through the inside of the wire 4 from an internal portion of the package and are outputted into the substrate 3 which is connected with the terminal 5. Further, signals derived from a wire 9 enter a terminal 6, pass through the outside of the wire 4 from the internal portion of the package and are outputted into the substrate 2 which is connected with the terminal 6. Since the terminals 5, 6 are insulated by an insulating body 7, a plurality of signals can be transmitted by a single lead wire. Thus, the package 1 can be miniaturized by making a multiple terminal, and an actually-mounting area and a weight can be reduced.


Inventors:
ONODA YOSHIHISA
TAKAHASHI MAKOTO
Application Number:
JP26987090A
Publication Date:
May 19, 1992
Filing Date:
October 08, 1990
Export Citation:
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Assignee:
NIPPON ELECTRIC IC MICROCOMPUT
International Classes:
H01L23/50; (IPC1-7): H01L23/50
Attorney, Agent or Firm:
Uchihara Shin