Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PACKAGE FOR STORING INFRARED SENSOR ELEMENT AND INFRARED SENSOR DEVICE
Document Type and Number:
Japanese Patent JP2003315148
Kind Code:
A
Abstract:

To provide an infrared sensor device which can accurately measure temperature without contact by making operational output between an infrared sensor element for receiving light and an infrared sensor element for compensation accurate, and improve a production yield of the infrared sensor device.

The infrared sensor device comprises a substrate 1, a frame body 2 in which a mounting part 2a is formed on a pair of side parts both of which are faced each other, a translucent cover member 6 in which a shading film 6a is provided on the upper part of an infrared sensor element 5 and covers the upper surface of the frame body 2 surrounding the infrared sensor element 5, and an input/output terminal inserted in the mounting part 2a. Between infrared sensors 4 and 5 and below the edge of the shading film 6a, a slit 2b having a certain length is formed downward from the upper edge of the frame body 2 on an inner surface of a pair of sides facing each other of the frame body 2. A shading plate 7, both ends of which are inserted in the slits 2b, is provided between the infrared sensors 4 and 5 at intervals of 0.1 to 0.3 mm apart from each infrared sensor.


Inventors:
KANCHIKU TAKESHI
Application Number:
JP2002123127A
Publication Date:
November 06, 2003
Filing Date:
April 24, 2002
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KYOCERA CORP
International Classes:
G01J1/02; G01J1/04; G01J1/42; G01J5/10; (IPC1-7): G01J1/02; G01J1/04; G01J1/42; G01J5/10