Title:
光半導体素子収納用パッケージ
Document Type and Number:
Japanese Patent JP3981256
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent thermal breakdown in an optical semiconductor element by efficiently dissipating the heat generated by the optical semiconductor element in operation to the outside. SOLUTION: An optical semiconductor element housing package comprises a base 1, a frame body 2 of an iron - nickel - cobalt alloy or iron - nickel alloy that is provided with a through hole 2a and a notch part 2b on the side part, a fixed member 6 to which an optical fiber member 8 is connected, a ceramic terminal body 9 in which a wiring layer is formed on a ceramics insulating body 10, and a lid member 3. The base 1 consists of 65-80 wt.% silicon carbide and 20-35 wt.% copper.
Inventors:
Shin Matsuda
Kimiaki Iguchi
Kimiaki Iguchi
Application Number:
JP2001311907A
Publication Date:
September 26, 2007
Filing Date:
October 09, 2001
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/12; H01S5/022; H01L23/14; H01L23/36; H01L23/373
Domestic Patent References:
| JP2001144361A | ||||
| JP2000192168A | ||||
| JP11029379A | ||||
| JP2001122682A | ||||
| JP2001274301A | ||||
| JP8279569A |