Title:
PACKAGE STRUCTURE FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3129066
Kind Code:
B2
Abstract:
PURPOSE: To provide an inexpensive package structure for semiconductor device which can easily deal with the alteration in the hole diameter of fixing bolt through simple remachining.
CONSTITUTION: The package for semiconductor device comprises a combination of a metal base plate 1 for heat dissipation and a resin enclosure case 2 with a metal reinforcing ring being embedded around a bolt hole 4 made through the enclosure case 2 at the position for fixing the package. The reinforcing ring is made by drawing and a hole corresponding to the size of a tightening bolt is made in the top face thereof. The cap-like reinforcing ring 9 having peripheral wall drawn to have S-shaped cross-section is embedded in the enclosure case and molded integrally.
Inventors:
Kiyoshi Iida
Application Number:
JP31878793A
Publication Date:
January 29, 2001
Filing Date:
December 20, 1993
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
H01L23/40; H01L23/02; H01L23/04; (IPC1-7): H01L23/04; H01L23/02; H01L23/40
Domestic Patent References:
| JP4111345A |
Attorney, Agent or Firm:
Masaharu Shinobe