Title:
PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2013243387
Kind Code:
A
Abstract:
To provide a package substrate and a fabricating method thereof which prevent a peeling phenomenon of a dry film and prevent a metal post from melting during a reflow process.
The package substrate includes: a substrate 100 including at least one conductive pad 111; an insulation layer 120 formed on the substrate 100 and including an opening through which the conductive pad 111 is exposed; a peeling prevention layer 130 formed along a top surface of the conductive pad 111 exposed through the opening and a sidewall of the insulation layer 120; a metal post 140 made of at least one alloy material and formed on the peeling prevention layer 130; and a heat-diffusion prevention film 150 formed on the metal post 140.
Inventors:
YI DONG-GYU
CHOI JIN-WON
JEONG SUNG-WON
YI DAE-YONG
YI GI-SOP
KIM JIN-HONG
CHOI JIN-WON
JEONG SUNG-WON
YI DAE-YONG
YI GI-SOP
KIM JIN-HONG
Application Number:
JP2013149296A
Publication Date:
December 05, 2013
Filing Date:
July 18, 2013
Export Citation:
Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H01L23/12; H01L21/60; H05K3/34
Domestic Patent References:
| JPH05218047A | 1993-08-27 | |||
| JPH03104230A | 1991-05-01 | |||
| JP2011124559A | 2011-06-23 | |||
| JP2010518637A | 2010-05-27 | |||
| JP2006066522A | 2006-03-09 | |||
| JP2008098210A | 2008-04-24 | |||
| JPH05218047A | 1993-08-27 | |||
| JPH03104230A | 1991-05-01 | |||
| JP2011124559A | 2011-06-23 | |||
| JP2011040713A | 2011-02-24 |
Attorney, Agent or Firm:
Konobu Kato
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