To provide a package having integrated H type package structure obtained by assembling an IC component constituting an oscillation circuit or the like to the outside of the package for a piezoelectric oscillator and capable of ajusting the piezoelectric oscillator by utilizing an existing packaging terminal without especially preparing an adjusting terminal only for the adjusting work of the piezoelectric oscillator which may be executed before loading the IC component and to provide a surface mounted piezoelectric oscillator and a frequency adjusting method.

An insulating case 1 provided with at least a Vcc packaging terminal, a Vcon packaging terminal, an Out packaging terminal, and a Gnd packaging terminal and having an approximately H-shaped vertical cross-section shape is provided with a metallic lid 15 for airtightly sealing an upper surface side recessed part 2 in a state that respective excitation electrodes on a piezoelectric oscillation element are electrically connected to two upper surface side inner pads 2 formed in the upper surface side recessed part 2 and an IC component 20 packaged on respective upper surface side inner pads arranged on the ceiling surface 3a of a lower surface side recessed part 3 and lower surface side inner pads 6 connected to respective packaging terminals. Connecting wiring patterns 40 for connecting the Vcc packaging terminal and the Vcon packaging terminal to two upper surface side inner pads 11 is arranged on the ceiling surface of the lower surface side recessed part so as to be exposed.