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Title:
PACKAGE
Document Type and Number:
Japanese Patent JP2000272666
Kind Code:
A
Abstract:

To provide a package scarcely or not at all having warpage in a flange part before and after a hot wall disinfection treatment regarding a package with a content filled in a molded main body to be sealed in use of a lid body.

The package comprises a molded main body and lid body, in which the main body is made up of a surface layer, an intermediate layer, and a seal layer, and the lid body is formed of a surface layer, an intermediate layer, and a seal layer, and further, the surface of the main body contains cyclopolyolefin polymer(COP) resin, and the surface layer of the lid body contains COP resin or biaxially oriented polyester resin, and the thickness ratio of each surface layer is 5-50% of the thickness of the main body and the lid body respectively.


Inventors:
OCHI SHUNSUKE
Application Number:
JP7496699A
Publication Date:
October 03, 2000
Filing Date:
March 19, 1999
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
B65D77/20; B32B27/00; (IPC1-7): B65D77/20; B32B27/00



 
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