Title:
包装されたホットメルト接着剤及びその包装方法
Document Type and Number:
Japanese Patent JP5080542
Kind Code:
B2
Abstract:
Multi-layer films are used to package hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. Multi-layer films wherein at least one layer has a melting point below about 100° C. is used to package low application temperature hot melt adhesives.
Inventors:
Harwell, Michael G.
Haener, Dale El.
Ryan, Reisa A.
Haener, Dale El.
Ryan, Reisa A.
Application Number:
JP2009239608A
Publication Date:
November 21, 2012
Filing Date:
October 16, 2009
Export Citation:
Assignee:
Henkel Akchen Gesell Shaft Und Company Comandito Gezel Shaft A Off Akchen
International Classes:
B65D85/00; B32B27/00; B65B63/08; B65D65/40; B65D75/06; B65B9/20
Domestic Patent References:
| JP7504144A | ||||
| JP2001527003A |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Yoshihiro Kobayashi
Kenichi Kato
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Yoshihiro Kobayashi
Kenichi Kato